With the rapid development of the microelectronics industry
the insulating interlayer material with low dielectric constant is urgently needed in order to improve the speed of transmission between the chips of large scale integrated circuit and meet the requirement of high integration. Polyimide is widely used as the insulating interlayer material in large scale integrated circuit. Reducing dielectric constant of polyimide has attracted much research attention in recent years. When using chemical methods to reduce the dielectric constant
modifying the molecular structures of polyimide is a basic approach. On the other hand
building the porous structure in materials is an effective way to further reduce the dielectric constant of polyimide. In this paper
the recent developments in modifying the molecular structure and building the porous structure are reviewed. Preparation methods of polyimide with low dielectric constant by both methods are summarized and the research prospects in this area are predicted.
Research Progress of Low Dielectric Constant Polyimides: the Relationship between Structure and Dielectric Properties
Research Progress of Graphite-like Materials Prepared from Polyimide-based Materials
Research Progress of Polyimide Based Thermally Conductive Insulating Composite Film
A Review of Polyimide Material as Silicon-based Anode Binder for Lithium Ion Batteries
Progress in Preparation of Thermally Conductive Polyimide Materials
Related Author
No data
Related Institution
Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences
School of Materials and Energy, Guangdong University of Technology
Key Laboratory of Photovoltaic and Energy Conservation Materials, Institute of Solid State Physics, Hefei Institutes of Physical Science, Chinese Academy of Sciences
China Enfei Engineering Technology Co.Ltd
Changzhou Institute of Advanced Materials, Beijing University of Chemical Technology