Silicones and sugar were adopted to modified phenol-formaldehyde resin to increase the flexibility of adhesive film with high intensity of glue. The species

mass of inclusion

time of inclusion of modifier was examined .It shown that the phenol-formaldehyde resin adhesive was prepared by the way that the organic silicon(8427) was 1.5% in total mass and sugar was 1.5% in total mass were joined in 45℃.Which the free formaldehyde content in resin was lower then 0.067%

strength of tensile shear was over 6MPa. The structure and functional were characterized by FT-IR and TG. It was shown that lots of —Si—O— were formed

the strength of tensile and thermal resistance were increased in a much degree.