Preparation and Properties of Covalent Organic Frame/Siloxane block Polyimide Films

WANG Qin; XU Wen-wei; LIU Xuan; HU Nan-tao

doi:10.14028/j.cnki.1003-3726.2025.25.023

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Preparation and Properties of Covalent Organic Frame/Siloxane block Polyimide Films

更新时间：2025-05-23

- Preparation and Properties of Covalent Organic Frame/Siloxane block Polyimide Films
- Polymer Bulletin Vol. 38, Issue 6, Pages: 903-912(2025)
- 作者机构：
  
  1.上海海洋大学工程学院，上海 201306
  2.上海交通大学薄膜与微细技术教育部重点实验室，上海 200240
- 作者简介：
- 基金信息：
- DOI：10.14028/j.cnki.1003-3726.2025.25.023
  CLC：
- Received：16 January 2025，
  
  Accepted：21 February 2025，
  
  Published Online：08 April 2025，
  
  Published：20 June 2025
- 稿件说明：
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王钦, 许文炜, 刘璇, 胡南滔. 共价有机框架/硅氧烷嵌段聚酰亚胺薄膜的制备及性能. 高分子通报, 2025, 38(6), 903-912.

Wang, Q.; Xu, W. W.; Liu, X.; Hu, N. T. Preparation and properties of covalent organic frame/siloxane block polyimide films. Polym. Bull. (in Chinese), 2025, 38(6), 903-912.
王钦, 许文炜, 刘璇, 胡南滔. 共价有机框架/硅氧烷嵌段聚酰亚胺薄膜的制备及性能. 高分子通报, 2025, 38(6), 903-912. DOI： 10.14028/j.cnki.1003-3726.2025.25.023.

Wang, Q.; Xu, W. W.; Liu, X.; Hu, N. T. Preparation and properties of covalent organic frame/siloxane block polyimide films. Polym. Bull. (in Chinese), 2025, 38(6), 903-912. DOI： 10.14028/j.cnki.1003-3726.2025.25.023.

摘要

具有超薄、疏水型和低介电常数特性的聚合物薄膜在柔性电子、储能器件和生物医学等领域具有潜在的应用前景。以聚酰亚胺基共价有机框架（PI-COFs）纳米片填料的含有硅氧烷（APPS）嵌段的聚酰胺酸（PAA）前驱体溶液，经过浇铸和热亚胺化工艺，获得了厚度为6 μm的共价有机框架/硅氧烷嵌段聚酰亚胺（COFs/PI）超薄复合薄膜。制备的超薄复合薄膜杨氏模量高达1.49 GPa，拉伸强度高达118.45 MPa；在1 MHz时，介电常数低至2.06；与裸PI膜相比，超薄复合薄膜的杨氏模量和拉伸强度分别提高79%和64%；同时，复合薄膜的介电常数降低24%，疏水性能提高67.8%，突出了二维PI-COFs纳米片对提高PI薄膜性能的关键作用。结果表明，具有热稳定PI分子结构的COFs纳米片可以赋予PI薄膜疏水性能和低介电常数。本复合薄膜的设计理念对开发具有超薄、疏水性和低介电常数等性能的聚合物薄膜具有一定的指导意义，可应用于多个领域。

Abstract

Polymer films with ultra-thin

hydrophobic and low dielectric constant properties have potential applications in flexible electronics

energy storage devices and biomedicine. A 6 μm thick covalent organic framework/siloxane block polyimide (COFs/PI) ultra-thin composite film was obtained by casting and thermoimidization of a polyamide acid (PAA) precursor solution containing siloxane (APPS) blocks filled with polyimide-based covalent organic frameworks (PI-COFs) nanosheets. The Young’s modulus and tensile strength of the prepared ultrathin composite films are as high as 1.49 GPa and 118.45 MPa. At 1 MHz

the dielectric constant is as low as 2.06; Compared with bare PI films

the Young’s modulus and tensile strength of ultrathin composite films are 79% and 64% higher

respectively. At the same time

the dielectric constant of the composite films decreased by 24% and the hydrophobic property increased by 67.8%

which highlighted the key role of two-dimensional PI-COFs nanosheets in improving the performance of PI films. The results show that COFs nanosheets with thermally stable PI molecular structure can confer hydrophobic properties and low dielectric constant on PI films. The design concept of the composite film has certain guiding significance for the development of ultra-thin

hydrophobic and low dielectric constant polymer films

and can be applied in various fields.

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