Bo, L. W.; Xu, Y.; Xi, K. Design and performance research of hyperbranched polysiloxane-modified high-temperature-resistant thermosetting polyimide adhesives. Polym. Bull. (in Chinese), 2025, 38(10), 1490–1499.
Bo, L. W.; Xu, Y.; Xi, K. Design and performance research of hyperbranched polysiloxane-modified high-temperature-resistant thermosetting polyimide adhesives. Polym. Bull. (in Chinese), 2025, 38(10), 1490–1499. DOI: 10.14028/j.cnki.1003-3726.2025.25.170.
Design and Performance Research of Hyperbranched Polysiloxane-modified High-temperature-resistant Thermosetting Polyimide Adhesives
Based on the excellent high-temperature resistance
high reactivity
and multiple reactive sites of amino-terminated hyperbranched polysiloxane (NH
2
-HPSi)
a series of modified acetylene-terminated thermosetting polyimide (PI) adhesives were prepared
via in situ
polymerization. The effects of NH
2
-HPSi on the bonding performance
thermal properties
and thermome
chanical properties of modified PI adhesives were systematically investigated. The results demonstrated that the shear strength of NH
2
-HPSi-modified PI adhesives increased from 10.3 MPa to 13.8 MPa
while the real-time shear strength at 400 ℃ improved from 0.9 MPa to 2.6 MPa. After aging at 400 ℃ for 3 h
the modified adhesive retained a shear strength of 12.2 MPa
with a retention rate of 86.6%. Moreover
the thermal stability of the modified PI adhesives was enhanced
with the thermal decomposition temperature increasing from 534.4 ℃ to a maximum of 553.8 ℃. This improvement is attributed to the formation of a highly dense dual-crosslinked network structure between NH
2
-HPSi and acetylene-terminated PI
which further enhances the high-temperature resistance and bonding performance of the PI adhesive. This study provides a novel approach for the preparation of advanced high-temperature-resistant PI adhesives.
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