Preparation and Properties of Copper-clad Laminate Based on Modified Bismaleimide Resin

LI Guo-liang; JIANG Wan-qi; LIN Li-cheng; WANG Xiao-chuan; CUI Jian; YAN Ye-hai

doi:10.14028/j.cnki.1003-3726.2026.26.108

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Preparation and Properties of Copper-clad Laminate Based on Modified Bismaleimide Resin

更新时间：2026-07-27

- Preparation and Properties of Copper-clad Laminate Based on Modified Bismaleimide Resin
- Polymer Bulletin Vol. 39, Issue 8, Pages: 1475-1483(2026)
- 作者机构：
  
  青岛科技大学高分子科学与工程学院　青岛 266042
  江苏锐巴新材料科技有限公司　连云港 222220
- 作者简介：
- 基金信息：
- DOI：10.14028/j.cnki.1003-3726.2026.26.108
  CLC：
- Received：01 March 2026，
  
  Accepted：15 April 2026，
  
  Online First：10 July 2026，
  
  Published：20 August 2026
- 稿件说明：
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李国梁, 蒋琬琪, 林立成, 王晓川, 崔健, 闫业海. 改性双马来酰亚胺树脂基覆铜板的制备与性能. 高分子通报, 2026, 39(8), 1475–1483.

Li, G. L.; Jiang, W. Q.; Lin, L. C.; Wang, X. C.; Cui, J.; Yan, Y. H. Preparation and properties of copper-clad laminate based on modified bismaleimide resin. Polym. Bull. (in Chinese), 2026, 39(8), 1475–1483.
李国梁, 蒋琬琪, 林立成, 王晓川, 崔健, 闫业海. 改性双马来酰亚胺树脂基覆铜板的制备与性能. 高分子通报, 2026, 39(8), 1475–1483. DOI： 10.14028/j.cnki.1003-3726.2026.26.108.

Li, G. L.; Jiang, W. Q.; Lin, L. C.; Wang, X. C.; Cui, J.; Yan, Y. H. Preparation and properties of copper-clad laminate based on modified bismaleimide resin. Polym. Bull. (in Chinese), 2026, 39(8), 1475–1483. DOI： 10.14028/j.cnki.1003-3726.2026.26.108.

摘要

覆铜板是制造印刷电路板的重要基材，其性能提升与优化已成为推动电子产业高质量发展的关键要素之一。作为发展国产高性能覆铜板的尝试，本研究以自制的改性双马来酰亚胺树脂BT3-15为基体、电子级玻纤布(E-GF)为增强材料，通过对工业级生产配方进行适当优化，采用工业化生产工艺流程和生产工艺参数，制备了BT3-15/E-GF覆铜板。研究结果表明，该覆铜板用BT3-15/E-GF复合材料的最佳玻璃化转变温度、热分解温度分别可达到248和392 ℃；介电常数(10 GHz)和介电损耗因子(10 GHz)分别可达到4.31和0.007。与对标产品(日本三菱瓦斯公司的HL832NS和HL832NSR)相比，本研究开发的覆铜板的整体性能与HL832NS和HL832NSR基本相当，在某些关键性能指标上还有一定幅度提升。

Abstract

Copper-clad laminate (CCL) is an important base material for producing printed circuit boards

and improving its performance has become a key factor in driving the high-quality development of the electronics industry. As a beneficial attempt to develop a domestic high-performance CCL

by employing the self-synthesized modified bismaleimide resin (BT3-15) as the matrix and electronic-grade glass fiber cloth (E-GF) as the reinforcement material

and appropriately optimizing the commercial formulation

a BT3-15/E-GF-based CCL was prepared by adopting the industrial production process and process parameters. The results revealed that the optimal glass transition temperature

thermal decomposition temperature were 248 and 392 ℃

respectively; dielectric constant at 10 GHz

and dissipation factor at 10 GHz of the BT3-15/E-GF composite were 4.31 and 0.007

respectively. Compared with the benchmark products

HL832NS and HL832NSR from Mitsubishi Gas Chemicals

the overall performance of the BT3-15/E-GF-based CCL was essentially equivalent. In some key performance indices

the developed CCL even shows superiority over HL832NS and/or HL832NSR.

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references

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