With the rapid development of the microelectronics industry

the insulating interlayer material with low dielectric constant is urgently needed in order to improve the speed of transmission between the chips of large scale integrated circuit and meet the requirement of high integration. Polyimide is widely used as the insulating interlayer material in large scale integrated circuit. Reducing dielectric constant of polyimide has attracted much research attention in recent years. When using chemical methods to reduce the dielectric constant

modifying the molecular structures of polyimide is a basic approach. On the other hand

building the porous structure in materials is an effective way to further reduce the dielectric constant of polyimide. In this paper

the recent developments in modifying the molecular structure and building the porous structure are reviewed. Preparation methods of polyimide with low dielectric constant by both methods are summarized and the research prospects in this area are predicted.