With the rapid development of electronic industry

more heat is accumulated during the operating of the electric device or equipment. The heat should be removed timely to ensure the normal operation of the equipment. Polymer-based thermally conductive composites are widely used due to their easy processability and low cost. Hexagonal boron nitride (h-BN) possesses both outstanding thermal conductivity and electrical insulativity

and has attracted increasing attention in fabrication of thermally conductive and electrically insulating composites in recent years. The research progress of h-BN/polymer thermally conductive composites is reviewed in this article from the aspects of size

surface modification

orientation structure of h-BN and hybrid fillers.