Polyimide is one kind of polymer material with a great potential of development. With high thermal expansion coefficient

the application of polyimide is limited

so reducing the thermal expansion coefficient of polyimide has become one of the research hotspots. The main preparation methods of polyimide films with low thermal expansion coefficient were reviewed. These methods include molecule structure design of monomer

copolymerization

blending method and adding nanoparticles. The effects of process conditions(such as casting methods

drawing conditions and so on) on thermal expansion coefficient were presented. Finally the future development trend of polyimide films with low thermal expansion coefficient was prospected.