Epoxy resin has been widely used due to its excellent mechanical properties

dielectric properties and good processability

mainly in the fields of electrical packaging

circuit boards

coatings

and combination agents. Because of the low thermal conductivity of the epoxy resin

it is easy to generate heat accumulation during the operation of the device

resulting in a significant reduction in the service life of the device. Therefore

improving the thermal conductivity of epoxy resin is particularly important for their application. By filling high thermal conductive filler into the epoxy resin

the thermal conductivity can be greatly improved. This mini-review briefly introduces the thermal conductivity mechanism of epoxy resin-based thermal conductive composites

focusing on the synergistic effect between various fillers and constructing an effective thermal conductive network

and forecasts its new development direction.