With the rapid development of aerospace

microelectronics and flexible display

polyimide (PI) with better general properties were in urgently needed. Thus

PI containing benzimidazole moieties with asymmetric charge distribution

catalytic capacity

ability of forming hydrogen bonds

and derivative reactivity

exhibited excellent structural designability

mechanical properties

heat resistance

thermal dimensional stability

and functionality

which arose more and more attention on PI containing benzimidazole moieties. In this review

advance in structure and properties of PI containing benzimidazole moieties was reviewed

the effects of benzimidazole moieties on polycondensation of poly(amide acid)

imidization

intermolecular interaction

aggregated structure

and the surface/interface structure of PI were especially highlighted. Finally

the future development of polyimide containing benzimidazole was prospected.