环保型聚酰亚胺泡沫复合集流体的制备与性能

江商宁; 申奥; 费晨韬; 闵永刚

doi:10.14028/j.cnki.1003-3726.2026.26.077

您当前的位置：

首页 >

文章列表页 >

环保型聚酰亚胺泡沫复合集流体的制备与性能

研究论文 | 更新时间：2026-05-29

- 环保型聚酰亚胺泡沫复合集流体的制备与性能
- Eco-friendly Preparation and Performance of Polyimide Foam Composite Current Collector
- 高分子通报 2026年
- 作者机构：
  
  广东工业大学材料与能源学院　广州　 510006
- 作者简介：
  
  ygmin@gdut.edu.cn
- 基金信息：
  
  国家自然科学基金(52003111);东莞重点研发计划(20231200300192);佛山市科技创新团队项目(1920001000108)
- DOI：10.14028/j.cnki.1003-3726.2026.26.077
  中图分类号：
- 收稿：2026-03-18，
  
  录用：2026-03-30，
- 稿件说明：
移动端阅览
江商宁, 申奥, 费晨韬, 闵永刚. 环保型聚酰亚胺泡沫复合集流体的制备与性能. 高分子通报, doi: 10.14028/j.cnki.1003-3726.2026.26.077

Jiang, S. N.; Shen, A.; Fei, C. T.; Min, Y. G. Eco-friendly preparation and performance of polyimide foam composite current collector. Polym. Bull. (in Chinese), doi: 10.14028/j.cnki.1003-3726.2026.26.077
江商宁, 申奥, 费晨韬, 闵永刚. 环保型聚酰亚胺泡沫复合集流体的制备与性能. 高分子通报, doi: 10.14028/j.cnki.1003-3726.2026.26.077 DOI：

Jiang, S. N.; Shen, A.; Fei, C. T.; Min, Y. G. Eco-friendly preparation and performance of polyimide foam composite current collector. Polym. Bull. (in Chinese), doi: 10.14028/j.cnki.1003-3726.2026.26.077 DOI：

摘要

以聚酰亚胺泡沫(PIF)为轻质多孔基底，采用乙醛酸无甲醛化学镀铜体系，并结合无钯银活化策略，制备了PIF@Cu复合集流体。系统研究了镀液pH、温度、乙醛酸浓度和镀铜时间对沉积速率与导电性能的影响。结果表明，在pH=12.5、60 ℃、乙醛酸浓度0.1762 mol·L

–1

、镀铜时间60 min条件下，样品综合性能最佳，沉积速率为15.71 µm·h

–1

，方阻为2.805 mΩ·sq

–1

。表征结果表明，碱化处理有利于改善PIF表面状态并促进后续银活化和铜层连续沉积，所得PIF@Cu复合集流体具有较好的附着力、形变导电稳定性和热稳定性。将其用作CR2032锂金属半电池负极集流体时，循环200次后的容量保持率为94.22%，高于铜箔集流体电池的92.40%；在2C条件下比容量为150.0 mAh·g

–1

，高于铜箔电池的128.0 mAh·g

–1

，并表现出较低的单位面积质量和较高的质量能量密度。该研究为无甲醛、低贵金属用量复合集流体的制备及其在轻量化集流体中的应用提供了实验依据。

Abstract

A PIF@Cu composite current collector was prepared using polyimide foam (PIF) as a lightweight porous substrate through a glyoxylic acid-based formaldehyde-free electroless copper plating process combined with a palladium-free silver activation strategy. The effects of bath pH

temperature

glyoxylic acid concentration

and plating time on the deposition rate and electrical conductivity were systemat

ically investigated. The optimal performance was obtained at pH 12.5

60 ℃

a glyoxylic acid concentration of 0.1762 mol·L

–1

and a plating time of 60 min

giving a deposition rate of 15.71 μm·h

–1

and a sheet resistance of 2.805 mΩ·sq

–1

. The obtained PIF@Cu showed good adhesion

thermal stability

and conductive stability under deformation. After 500 bending cycles

the increase in sheet resistance was 25.0%

lower than that of Cu foil. When used as the anode current collector in a CR2032 lithium-metal half-cell

the capacity retention after 200 cycles was 94.22%

higher than 92.40% for the Cu foil-based cell

and the specific capacity at 2C reached 150.0 mAh·g

–1

higher than 128.0 mAh·g

–1

for the Cu foil-based cell. In addition

PIF@Cu exhibited a lower areal density and a higher gravimetric energy density than commercial Cu foil. These results indicate that PIF@Cu has advantages over commercial Cu foil in lightweight design

conductive stability

and electrochemical performance.

关键词

Keywords

references

Tian, D K. ; Xu, Y. D. ; Wang, Y. ; Lei, Z. M. ; Lin, Z. Q. ; Zhao, T. ; Hu, Y. G. ; Sun, R. ; Wong, C. P . In-situ metallized carbon nanotubes/poly(styrene-butadiene-styrene) (CNTs/SBS) foam for electromagnetic interference shielding . Chem. Eng. J. , 2021 , 420 , 130482 .

Xu, L J. ; Shi, X. Y. ; Chai, M. Y. ; Ji, J. ; Xu, Z. K. ; Wan, L. S . Surface metallization of porous polymer materials for multifunctional applications . Langmuir , 2020 , 36 ( 6 ), 1454 – 1461 .

Luo, Y ; Guo, Y. B. ; Wei, C. ; Chen, J. W. ; Zhao, G. Y. ; Yuan, Q. ; Zhu, Y. T . Lightweight, compressible, and stretchable composite foams for ultra-efficient and high-stable electromagnetic interference shielding materials . Carbon , 2023 , 215 , 118480 .

Maddipatla, S ; Rauf, H. ; Osterman, M. ; Arshad, N. ; Pecht, M . Swelling mechanisms, diagnostic applications, and mitigation strategies in lithium-ion batteries . Batteries , 2025 , 11 ( 10 ), 356 .

Schommer, A ; Corzo, M. O. ; Henshall, P. ; Morrey, D. ; Collier, G . Stack pressure on lithium-ion pouch cells: a comparative study of constant pressure and fixed displacement devices . J. Power Sources , 2025 , 629 , 236019 .

张澧桐 , 孙立强 , 张瑞涵 , 王佰超 , 张洪明 . 聚酰亚胺泡沫的制备及热物性能研究 . 功能材料 , 2025 , 56 ( 2 ), 2179 – 2185 .

Ugadi, S ; Muduli, B. ; Yeshamoni, S. ; Mukherjee, M. ; Neelakantan, L . Electroless copper plating of 3D-printed polymer foam: a promising method to fabricate electrodes for denitrification . Mater. Lett. , 2024 , 372 , 137019 .

Qian, K P. ; Zhou, J. Y. ; Miao, M. ; Wu, H. M. ; Thaiboonrod, S. ; Fang, J. H. ; Feng, X . Highly ordered thermoplastic polyurethane/aramid nanofiber conductive foams modulated by kevlar polyanion for piezoresistive sensing and electromagnetic interference shielding . Nano Micro Lett. , 2023 , 15 ( 1 ), 88 .

Taghavi Pourian Azar, G ; Fox, D. ; Fedutik, Y. ; Krishnan, L. ; Cobley, A. J . Functionalised copper nanoparticle catalysts for electroless copper plating on textiles . Surf. Coat. Technol. , 2020 , 396 , 125971 .

Kim, N K. ; Kang, S. M. ; Kim, T. ; Kim, S. ; Kim, G. H . Electroless plating on polymer surfaces: comprehensive review of mechanism, process, analysis, and future applications . Adv. Mater. Interfaces , 2025 , 12 ( 11 ), 2400931 .

Zheng, A N. ; Wang, Z. Y. ; Yang, J. Q. ; Jin, L. ; Yang, F. Z. ; Zhan, D. P . Advanced Ag nanoparticles for the catalyzation of glyoxylic acid oxidation in through-holes electroless copper metallization . J. Colloid Interface Sci. , 2023 , 648 , 270 – 277 .

Sajjadi Shourije, S M. J. ; Vitry, V. ; Taghavi Pourian Azar, G. ; Tasso Guaraldo, T. ; Mesbah, M. ; Cobley, A. J . An innovative approach for using non-noble metals as an alternative initiator for electroless copper plating of non-conductive materials . Mater. Chem. Phys. , 2026 , 347 , 131462 .

Bragaglia, M ; Paleari, L. ; Mariani, M. ; Nanni, F . Sustainable formaldehyde-free copper electroless plating on carbon-epoxy substrates . J. Mater. Sci. Mater. Electron. , 2024 , 35 ( 10 ), 707 .

Absara Fdo, S ; Venkatesh, P. ; BalaRamesh, P . Electroless copper deposition using 3 mercapto propionic acid as an additive . Mater. Today Proc. , 2021 , 47 , 1883 – 1886 .

Sung, Y ; Chou, Y. H. ; Hwu, W. H. ; Fan, Y. C. ; Cheng, J. L. ; Ger, M. D . Electroless copper deposition by non-isothermal deposition technology . Mater. Chem. Phys. , 2009 , 113 ( 1 ), 303 – 308 .

Inoue, F ; Philipsen, H. ; van der Veen, M. ; Van Huylenbroeck, S. ; Armini, S. ; Struyf, H. ; Shingubara, S. ; Tanaka, T . Development of glyoxylic acid based electroless copper deposition on ruthenium . ECS Trans. , 2015 , 64 ( 40 ), 41 – 55 .

Ghosh, S . Electroless copper deposition: A critical review . Thin Solid Films , 2019 , 669 , 641 – 658 .

Xiang, J L. ; Zhou, G. Y. ; Hong, Y. ; He, W. ; Wang, S. X. ; Chen, Y. M. ; Wang, C. ; Tang, Y. ; Sun, Y. K. ; Zhu, Y. K . Direct additive copper plating on polyimide surface with silver ammonia via plasma modification . Appl. Surf. Sci. , 2022 , 587 , 152848 .

Cui, X Y. ; Hutt, D. A. ; Conway, P. P . Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate . Thin Solid Films , 2012 , 520 ( 19 ), 6095 – 6099 .

Pawar, K ; Dixit, P . A critical review of copper electroless deposition on glass substrates for microsystems packaging applications . Surf. Eng. , 2022 , 38 ( 6 ), 576 – 617 .

Lam, N H. ; Smith, R. P. ; Le, N. ; Thuy, C. T. T. ; Tamboli, M. S. ; Tamboli, A. M. ; Alshehri, S. ; Ghoneim, M. M. ; Truong, N. T. N. ; Jung, J. H . Evaluation of the structural deviation of Cu/Cu 2 O nanocomposite using the X-ray diffraction analysis methods . Crystals , 2022 , 12 ( 4 ), 566 .

Wei, Z. ; Xia, T. ; Feng, W. ; Dai, J. ; Wang, Q. ; Li, W. ; Yan, P . Preparation and particle size characterization of Cu nanoparticles prepared by anodic arc plasma . Rare Met. , 2006 , 25 ( 2 ), 172 – 176 .

Pan, C ; Chen, S. J. ; Huang, Y. H. ; Wang, L. ; Luo, J. L. ; Fu, X. Z . A facile method to fabricate lightweight copper coated polyimide film current collectors for lithium-ion batteries . J. Power Sources , 2022 , 528 , 231207 .

Wu, X X. ; Chen, S. J. ; Liu, D. N. ; Ye, C. Y. ; Si, F. Z. ; Zhang, Y. ; Yang, Y. ; Luo, J. L. ; Fu, X. Z . Polymer@Cu composite foils with through-hole arrays as lightweight and flexible current collectors for lithium-ion batteries . J. Energy Storage , 2023 , 74 , 109208 .

Liu, C S. ; Hu, J. Q. ; Mao, T. T. ; Liao, S. Y. ; Feng, R. M. ; Liu, Y. D. ; Min, Y. G . Copper-coated porous polyimide as ultralight and safe current collectors for advanced LIBs . Chinese J. Polym. Sci. , 2024 , 42 ( 4 ), 521 – 531 .

Chen, X L. ; Liu, X. C. ; Ye, N. ; Zhan, Y. ; Luo, Y. D. ; Tang, J. C. ; Zhuo, H. O . Preparation and properties of PI@Cu composite films current collectors under silver catalysis for lithium-ion batteries . Surf. Interfaces , 2024 , 54 , 105156 .

Wang, X ; Wang, J. H. ; Liu, S. ; Zhou, T. H. ; Li, Y. H. ; Luo, Z. Y. ; Pan, Y. ; Liao, X. B. ; Pan, J. N . A flexible porous polyimide/copper composite film toward high-mass-loading anodes in lithium-ion batteries . J. Energy Storage , 2024 , 103 , 114363 .

Liu, J H. ; Liu, S. Y. ; Zhao, L. L. ; Luo, Y. J. ; Ran, Y. N. ; Tang, M. H. ; Shi, G. L. ; Liu, Y. X. ; Lin, J. L. ; Wang, M. X. ; Li, Z. N. ; Yao, Z. ; Yang, Z. S. ; Fu, H . A bidirectionally conductive composite membrane based on copper-coated electrospun PI-CNT fibers as a current collector for lithium-ion batteries . RSC Adv. , 2026 , 16 ( 8 ), 7178 – 7188 .

浏览量

下载量

CSCD

文章被引用时，请邮件提醒。

提交

工具集

关联资源

空心玻璃微珠复合聚酰亚胺泡沫的泡孔结构与性能

挤出机模块化结构管材环向增强机头的设计及有限元模拟分析

高分子化学综合实验设计——苯并二噻吩基聚合物的合成及其性能研究

基于甲基乙烯基醚–马来酸酐共聚物的应用研究进展

超临界流体发泡聚乳酸技术研究及应用进展