Research and Medium Scale Production of Epoxy Moulding Compound for LSI

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- Research and Medium Scale Production of Epoxy Moulding Compound for LSI
- Polymer Bulletin Vol. 9, Issue 3, Pages: 189-191(1996)
- 作者机构：
  
  中国科学院化学研究所，北京，100080
- 作者简介：
- 基金信息：
- DOI：10.14028/j.cnki.1003-3726.1996.03.010
  CLC：
- Published：1996-09，
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Zongxian Sun, Gang Li, Yisheng Wu, Ying Huang, Xin Liu. Research and Medium Scale Production of Epoxy Moulding Compound for LSI. [J]. Polymer Bulletin 9(3):189-191(1996)
DOI：

Zongxian Sun, Gang Li, Yisheng Wu, Ying Huang, Xin Liu. Research and Medium Scale Production of Epoxy Moulding Compound for LSI. [J]. Polymer Bulletin 9(3):189-191(1996) DOI： 10.14028/j.cnki.1003-3726.1996.03.010.

本文叙述了 LSI用环氧塑封料研究与中试的主要成果、技术要点及成果应用。

The main achievement

technical information of Recearch and Medium Scale Production of Epoxy Moulding Compound for LSI are introduced.

环氧塑封料有机硅改性剂低应力大规模集成电路

Epoxy moulding compoundSilastic modifierLow stressLSI

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