Curing Reaction Kinetic of Dendritic Polymer/Epoxy Resin System

Yan WANG; Xian-sheng WANG; Hai-sheng CHEN

doi:10.14028/j.cnki.1003-3726.2006.11.007

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Curing Reaction Kinetic of Dendritic Polymer/Epoxy Resin System

更新时间：2022-09-18

- Curing Reaction Kinetic of Dendritic Polymer/Epoxy Resin System
- Polymer Bulletin Vol. 19, Issue 11, Pages: 40-43(2006)
- 作者机构：
  
  1.中国科学院广州化学研究所，广州　510650
  2.中国科学院研究生院，北京　100049
- 作者简介：
- 基金信息：
- DOI：10.14028/j.cnki.1003-3726.2006.11.007
  CLC：
- Published：2006-11，
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Yan WANG, Xian-sheng WANG, Hai-sheng CHEN. Curing Reaction Kinetic of Dendritic Polymer/Epoxy Resin System. [J]. Polymer Bulletin 19(11):40-43(2006)
DOI：

Yan WANG, Xian-sheng WANG, Hai-sheng CHEN. Curing Reaction Kinetic of Dendritic Polymer/Epoxy Resin System. [J]. Polymer Bulletin 19(11):40-43(2006) DOI： 10.14028/j.cnki.1003-3726.2006.11.007.

摘要

用示差扫描量热仪（DSC）对树枝形大分子PAMAM/双酚-A 型环氧树脂体系的固化反应动力学过程进行了分析。通过Kissinger 法求得体系固化反应的表观活化能ΔE 为59.78kJ/mol，通过Crane 法求得体系的固化反应级数n＝0.91，并计算出了反应速率常数k 和不同升温速率下的频率因子A。根据动态DSC 数据确定体系合适的固化反应温度为80~90℃，后固化温度为140℃。

Abstract

The reaction process of PAMAM/DGEBA curing system was carefully analyzed by DSC.The apparent activation energy(ΔE) was 59.78kJ/mol

which was calculated by Kissinger method.The reaction order n=0.91

which was calculated by Crane method.Reaction rate constants k and frequency factor A in various temperature were also calculated according to Crane method.The curing technique were determined by DSC analysis

the suitable curing temperature was 80~90℃ and the post-curing temperature was 140℃.

关键词

PAMAM环氧树脂固化动力学

Keywords

PAMAMEpoxy resinCuring kinetics

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