The intrinsic low thermal conductivity of polymer materials cannot meet the heat dissipation requirements of modern electronic devices. Therefore

it is important to improve the thermal conductivity of polymers to achieve high-efficiency heat transfer. Hexagonal boron nitride (h-BN) have many advantages such as excellent electrical breakdown strength

high thermal conductivity

excellent dielectric properties

low hygroscopicity and high temperature oxidation resistance. It is also an ideal filler for the preparation of low dielectric constant

low dielectric loss and high thermal conductivity polymer composites. The recent research progress of preparation of BNNSs

as well as methods of improving the thermal conductivity of polymer composites by using BN are reviewed in this article.