High-performance thermal conductive materials have played more and more important roles in the growing microelectronics industry and have attracted widespread attention. Hexagonal boron nitride (h-BN) is one of the most important fillers for the preparation of high thermal conductivity and multifunctional composite materials

while boron nitride nanosheets (BNNS) having similar structure to graphene show better performance than h-BN. We summarize the preparation of BNNS and the surface modification methods

and application in the fabrication of BNNS/polymer thermal conductive composites.