Most polymers have poor thermal conductivity and other shortcomings

which limit their applications in many fields. Therefore

it is necessary to add thermal conductive fillers to enhance the thermal conductivity of polymers and improve the use value of materials. However

it is difficult to uniformly disperse the thermally conductive filler into the polymer

which greatly restricts its application in high-performance thermal interface materials. Therefore

it is necessary to functionalize the filler to improve its dispersibility and reduce the interfacial thermal resistance between the filler and the matrix. Regardless of the type of surface functionalization

phonon transmission between fillers will inevitably be weakened. Designing structures by chemical vapor deposition

sol-gel method and other methods can significantly reduce the interface contact thermal resistance between filler particles. Constructing a three-dimensional thermally conductive connection network is an effective and feasible strategy to reduce the interface thermal resistance between filler particles.