Advances in Structure and Properties of Polyimide Containing Benzimidazole Moieties

QIN Yi-tian; YIN Qian; WANG Xu; LIU Xiang-yang

doi:10.14028/j.cnki.1003-3726.2023.08.003

您当前的位置：

首页 >

文章列表页 >

Advances in Structure and Properties of Polyimide Containing Benzimidazole Moieties

更新时间：2023-06-26

- Advances in Structure and Properties of Polyimide Containing Benzimidazole Moieties
- Polymer Bulletin Vol. 36, Issue 8, Pages: 929-940(2023)
- 作者机构：
  
  四川大学高分子科学与工程学院　高分子材料工程国家重点实验室，　成都　610065
- 作者简介：
- 基金信息：
- DOI：10.14028/j.cnki.1003-3726.2023.08.003
  CLC：
- Published：20 August 2023，
  
  Received：30 November 2022，
  
  Revised：11 February 2023，
扫描看全文
QIN Yi-tian, YIN Qian, WANG Xu, LIU Xiang-yang. Advances in Structure and Properties of Polyimide Containing Benzimidazole Moieties. [J]. Polymer Bulletin 36(8):929-940(2023)
DOI：

QIN Yi-tian, YIN Qian, WANG Xu, LIU Xiang-yang. Advances in Structure and Properties of Polyimide Containing Benzimidazole Moieties. [J]. Polymer Bulletin 36(8):929-940(2023) DOI： 10.14028/j.cnki.1003-3726.2023.08.003.

摘要

随着航空航天、微电子和柔性显示等领域的快速发展

其对高性能聚酰亚胺(polyimide

PI)的性能要求不断提高。而在众多改性PI中

含苯并咪唑杂环的PI因苯并咪唑环不对称的电荷分布、催化活性、可形成氢键

以及可进一步衍生反应性的特点

展现出优异的结构可设计性、力学性能、耐热性、热尺寸稳定性以及功能性

因此受到越来越广泛的关注。本文综述了近年来国内外关于含苯并咪唑结构单元的PI结构与性能研究进展

重点介绍了苯并咪唑环对聚酰胺酸(poly(amide acid)

PAA)缩聚反应、酰亚胺化反应、分子间相互作用、聚集态结构

以及PI复合材料表/界面性能等的影响

并对含苯并咪唑型PI未来的发展进行了展望。

Abstract

With the rapid development of aerospace

microelectronics and flexible display

polyimide (PI) with better general properties were in urgently needed. Thus

PI containing benzimidazole moieties with asymmetric charge distribution

catalytic capacity

ability of forming hydrogen bonds

and derivative reactivity

exhibited excellent structural designability

mechanical properties

heat resistance

thermal dimensional stability

and functionality

which arose more and more attention on PI containing benzimidazole moieties. In this review

advance in structure and properties of PI containing benzimidazole moieties was reviewed

the effects of benzimidazole moieties on polycondensation of poly(amide acid)

imidization

intermolecular interaction

aggregated structure

and the surface/interface structure of PI were especially highlighted. Finally

the future development of polyimide containing benzimidazole was prospected.

关键词

聚酰亚胺苯并咪唑结构与性能酰亚胺化反应聚集态表/界面

Keywords

PolyimideBenzimidazoleStructure and PropertiesImidizationAggregated structureSurface/Interface structure

references

更多指标>

Views

142

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Research Progress of Low Dielectric Constant Polyimides: the Relationship between Structure and Dielectric Properties

Research Progress of Graphite-like Materials Prepared from Polyimide-based Materials

Research Progress of Polyimide Based Thermally Conductive Insulating Composite Film

Progress in Preparation of Thermally Conductive Polyimide Materials

A Review of Polyimide Material as Silicon-based Anode Binder for Lithium Ion Batteries

Related Author

No data

Related Institution

Shanghai Institute of Organic Chemistry, Chinese Academy of Sciences

School of Materials and Energy, Guangdong University of Technology

Key Laboratory of Photovoltaic and Energy Conservation Materials, Institute of Solid State Physics, Hefei Institutes of Physical Science, Chinese Academy of Sciences

School of Chemistry and Chemical Engineering, Northwestern Polytechnical University

School of Chemistry, Beihang University

⁰