Progress in Preparation of Thermally Conductive Polyimide Materials

LI Mu-kun; GUO Yong-qiang; RUAN Kun-peng; GU Jun-wei

doi:10.14028/j.cnki.1003-3726.2023.08.007

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Progress in Preparation of Thermally Conductive Polyimide Materials

更新时间：2023-06-26

- Progress in Preparation of Thermally Conductive Polyimide Materials
- Polymer Bulletin Vol. 36, Issue 8, Pages: 979-997(2023)
- 作者机构：
  
  1.西北工业大学伦敦玛丽女王大学工程学院，　西安　710072
  2.北京航空航天大学化学学院，　北京　100083
  3.西北工业大学化学与化工学院，　西安　710072
- 作者简介：
- 基金信息：
- DOI：10.14028/j.cnki.1003-3726.2023.08.007
  CLC：
- Published：20 August 2023，
  
  Received：07 November 2022，
  
  Revised：07 December 2022，
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LI Mu-kun, GUO Yong-qiang, RUAN Kun-peng, GU Jun-wei. Progress in Preparation of Thermally Conductive Polyimide Materials. [J]. Polymer Bulletin 36(8):979-997(2023)
DOI：

LI Mu-kun, GUO Yong-qiang, RUAN Kun-peng, GU Jun-wei. Progress in Preparation of Thermally Conductive Polyimide Materials. [J]. Polymer Bulletin 36(8):979-997(2023) DOI： 10.14028/j.cnki.1003-3726.2023.08.007.

摘要

聚酰亚胺(PI)具有优异的绝缘性能、力学性能、耐热性能、耐辐射性能等

广泛应用于高精密智能控制系统、5G通讯终端与基站等领域。但PI材料的导热系数(λ)较低

无法满足当下及未来高功率电子电气设备的导热/散热需求。因此

研究开发新一代PI导热材料成为国内外的研究热点。本文系统总结了PI导热材料的研究进展

主要从本征型导热PI和PI导热复合材料两方面展开

介绍了相关概念、分类与影响因素

阐述了PI导热材料的制备及研究进展

分析了PI导热材料的内禀导热机理

最后总结了该领域内目前面临的挑战、展望了PI导热材料的发展方向。

Abstract

Polyimide (PI) has excellent insulation properties

mechanical properties

heat resistance

radiation resistance

etc.

and is widely used in high-precision intelligent control systems

5G communication terminals and base stations. However

the thermal conductivity coefficients (λ) of PI materials are low

which cannot meet the thermal conductivity/heat dissipation requirements of current and future high-power electronic and electrical equipment. Therefore

research and development of the new generation of thermally conductive PI materials has become a research hotspot at home and abroad. This review systematically summarizes the research progress of thermally conductive PI materials

mainly from two aspects: intrinsically thermally conductive PI and thermally conductive PI composites. Related concepts

classifications and influencing factors are introduced

the preparation and research progress of thermally conductive PI materials are expounded

and the thermal conduction mechanisms of thermally conductive PI materials are analyzed. Finally

the current challenges in this field are summarized

and the development directions of thermally conductive PI materials are prospected.

关键词

聚酰亚胺本征导热导热复合材料导热系数

Keywords

PolyimideIntrinsic thermal conductivityThermally conductive compositesThermal conductivity coefficient

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