Polyimide (PI) acting as one of the best polymer materials

has been widely used in various microelectronic devices. With the sharp increase in the power density of electronic components

thermal accumulation has become a bottleneck restricting their further development. PI film with high thermal conductivity and electrical insulation is considered as a promising strategy to solve the problem. However

the low thermal conductivity of PI film cannot meet the demand on fast heat dissipation of electronic device. At present

researchers have performed plenty of work in improving the thermal conductivity of PI film. This paper firstly discusses the mechanism of heat transfer in PI film

and then reports the research progress of thermally conductive PI film in recent years

focusing on insulating thermally conductive filler

electrically and thermally conductive filler coated with insulating layer and three-dimensional thermally conductive skeleton reinforcing the thermal conductivity of PI film. Finally

the progress of research on the thermally conductive PI film and the possible future development trends are summarized and prospected.