Research Progress of Low Dielectric Constant Polyimides: the Relationship between Structure and Dielectric Properties

LI Ming-hui; DAI Meng-lu; LIU Feng-ping; HOU Jia-ren; HUANG Gang; GUO Ying-jie; SHI Man-ling; FENG Yuan-hao; YANG Zhuo-yi; ZHAO Le-yao; SUN Jing; FANG Qiang

doi:10.14028/j.cnki.1003-3726.2023.08.011

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Research Progress of Low Dielectric Constant Polyimides: the Relationship between Structure and Dielectric Properties

更新时间：2023-06-26

- Research Progress of Low Dielectric Constant Polyimides: the Relationship between Structure and Dielectric Properties
- Polymer Bulletin Vol. 36, Issue 8, Pages: 1042-1075(2023)
- 作者机构：
  
  中国科学院上海有机化学研究所，　上海　200032
- 作者简介：
- 基金信息：
- DOI：10.14028/j.cnki.1003-3726.2023.08.011
  CLC：
- Published：20 August 2023，
  
  Received：30 November 2022，
  
  Revised：29 January 2023，
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LI Ming-hui, DAI Meng-lu, LIU Feng-ping, HOU Jia-ren, HUANG Gang, GUO Ying-jie, SHI Man-ling, FENG Yuan-hao, YANG Zhuo-yi, ZHAO Le-yao, SUN Jing, FANG Qiang. Research Progress of Low Dielectric Constant Polyimides: the Relationship between Structure and Dielectric Properties. [J]. Polymer Bulletin 36(8):1042-1075(2023)
DOI：

LI Ming-hui, DAI Meng-lu, LIU Feng-ping, HOU Jia-ren, HUANG Gang, GUO Ying-jie, SHI Man-ling, FENG Yuan-hao, YANG Zhuo-yi, ZHAO Le-yao, SUN Jing, FANG Qiang. Research Progress of Low Dielectric Constant Polyimides: the Relationship between Structure and Dielectric Properties. [J]. Polymer Bulletin 36(8):1042-1075(2023) DOI： 10.14028/j.cnki.1003-3726.2023.08.011.

摘要

聚酰亚胺是目前最常用的工程塑料之一

它具有优异的热稳定性和机械性能

同时也具有较低的介电常数和介电损耗

在微电子领域也有广泛应用。5G通讯技术的发展对具有更低介电常数的聚酰亚胺材料提出了需求。在本文中

我们综述了近年来低介电聚酰亚胺材料的发展

并对聚酰亚胺结构与其介电性能的关系进行了讨论

以期对今后低介电聚酰亚胺材料的制备提供指导意义。

Abstract

Polyimide (PI) is one of the most important engineering plastics. It possesses excellent thermal stabilities and mechanical properties

as well as low dielectric constant and dielectric loss

which make it widely used in the field of microelectronics. With the development of 5G communication technology

polyimide materials with lower dielectric constant are required. In this paper

we review the development of low dielectric polyimide materials in recent years

and discuss the relationship between the structures of polyimide and the dielectric properties

expecting to provide guidance for the preparation of low dielectric polyimide materials in the future.

关键词

聚酰亚胺低介电常数高频通信

Keywords

PolyimideLow dielectric constantHigh frequency communication technology

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