Linear phenolic resin is the key functional material as the base resin due to excellent heat tolerance

reliability and electrical insulation in the field of integrated circuits. However

traditional phenolic resin has some problems such as poor stability

slow photosensitive speed

low transparency

resolution and mechanical strength

which increase the application cost and technical difficulty

and reduce the economic benefits of phenolic resin in the field of integrated circuits. Therefore

the traditional linear phenolic needs to be modified to resin for better application in the field of integrated circuits. In this review

the recent research status of linear phenolic resin in chip photoresist

electronic packaging and copper-coated plate was reviewed

the main methods of modifying linear phenolic resin were summarized and the development trend of linear phenolic resin was prospected

providing a reference for the research and development of high-performance integrated circuit application materials in the future.