聚苯醚基复合材料介电性能的研究进展

姬林远; 周水军; 李建通; 房晓敏

doi:10.14028/j.cnki.1003-3726.2026.26.071

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聚苯醚基复合材料介电性能的研究进展

综述 | 更新时间：2026-07-06

- 聚苯醚基复合材料介电性能的研究进展
- Research Progress on the Dielectric Properties of Polyphenylene Ether-based Composites
- 高分子通报 2026年39卷第7期页码：1080-1090
- 作者机构：
  
  河南大学化学与分子科学学院　开封 475004
- 作者简介：
  
  10150168@vip.henu.edu.com
  xmfang@henu.edu.com
- 基金信息：
- DOI：10.14028/j.cnki.1003-3726.2026.26.071
  中图分类号：
- 收稿：2026-02-11，
  
  录用：2026-04-09，
  
  网络首发：2026-06-10，
  
  纸质出版：2026-07-20
- 稿件说明：
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姬林远, 周水军, 李建通, 房晓敏. 聚苯醚基复合材料介电性能的研究进展. 高分子通报, 2026, 39(7), 1080–1090.

Ji, L. Y.; Zhou, S. J.; Li, J. T.; Fang, X. M. Research progress on the dielectric properties of polyphenylene ether-based composites. Polym. Bull. (in Chinese), 2026, 39(7), 1080–1090.
姬林远, 周水军, 李建通, 房晓敏. 聚苯醚基复合材料介电性能的研究进展. 高分子通报, 2026, 39(7), 1080–1090. DOI： 10.14028/j.cnki.1003-3726.2026.26.071.

Ji, L. Y.; Zhou, S. J.; Li, J. T.; Fang, X. M. Research progress on the dielectric properties of polyphenylene ether-based composites. Polym. Bull. (in Chinese), 2026, 39(7), 1080–1090. DOI： 10.14028/j.cnki.1003-3726.2026.26.071.

摘要

5G、6G通信、云计算及毫米波雷达技术的迭代演进，信号传输频率已迈入毫米波乃至太赫兹频段，高频高速通信技术的演进对信号传输完整性提出了严苛要求，迫使电路板(PCB)绝缘基材向低介电常数(

)与低介电损耗(

)方向迭代。聚苯醚(PPO)凭借着优异的介电性能成为绝缘基材的热门材料之一。然而，商用高分子量PPO熔体黏度极高，在玻璃纤维布中的浸润性差等问题限制了PPO的应用。本文综述了未改性PPO树脂作为电子封装材料的不足以及PPO目前的主要改性策略，包括化学改性和物理改性。在化学改性方面，通过低聚物化、接枝官能团、共聚等化学手段，在分子结构上进行设计来改善其介电性能与加工性能。在物理改性方面，通过物理共混来构建多相合金体系，分析了PPO与环氧树脂(EP)、氰酸酯(CE)等树脂共混的介电性能、加工性，以及无机填料在PPO基体中的作用。最后，指出了目前研究阶段PPO所存在的不足，对其在高频电子封装领域的应用前景进行了展望。

Abstract

With the iterative evolution of 5G

6G communications

cloud computing

and mill

imeter-wave radar technologies

signal transmission frequencies have entered the millimeter-wave and even terahertz bands. The advancement of high-frequency

high-speed communication technologies imposes stringent requirements on signal transmission integrity

compelling the development of circuit board (PCB) insulating substrates with lower dielectric constant (

) and dielectric loss (

). Poly(phenylene oxide) (PPO) has emerged as a preferred insulating substrate material due to its outstanding dielectric properties. However

commercial high-molecular-weight PPO exhibits extremely high melt viscosity and poor wettability in fiberglass cloth

which limits its application. The limitations of unmodified PPO resin as an electronic packaging material and the main modification strategies for PPO

including chemical and physical approaches

are reviewed in this paper. In terms of chemical modification

the dielectric properties and processing properties of the polymer were improved by means of oligomerization

grafting functional groups

copolymerization and other chemical methods. In the aspect of physical modification

the dielectric properties and processability of PPO blends with epoxy resin (EP) and cyanate ester (CE) were analyzed

and the effect of inorganic filler on PPO matrix was studied. Finally

the current limitations of PPO in research stages are identified

and the application prospects of PPO-based materials in high-frequency electronic packaging are explored.

关键词

Keywords

references

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