The thermosetting epoxy resins have excellent physical and chemical properties

and they have outstanding adhesive strength to the surface of both metallic and non-metallic materials. They are widely applied in casting

impregnation

lamination

adhesive and coating production

and other uses. However

epoxy resins have certain disadvantages

including brittleness

low resistance to impact and poor heat resistance

which limit their application. Many researchers have made fruitful studies on modification of epoxy resin. For example

organosilicon compound modified epoxy resin has unique advantages in improving its thermal oxidative stability

toughness and ablation resistance. In recent years

new results have been achieved in modifying epoxy resins using functional organic silicone compounds and polymers as modifiers. These researches include copolymerization modification

curing agent crosslinking modification

blending/cocrosslinking with resin epoxy modification

compatibilization modification

interpenetrating polymer network (IPN) modification

flame retardants introduced modification and nano/micron composite modification. This paper is aimed to draw a conclusion of the investigative progress of the research in organosilicon modified epoxy resins listed above. In addition

we predict the potential application and possible future development directions of silicone modified epoxy materials.