QIAO Hai-tao. Analysis of Compositions and Cure Kinetics of High Temperature Adhesives[J]. Polymer Bulletin, 2022,35(12):146-153. DOI: 10.14028/j.cnki.1003-3726.2022.12.017.
Compositions of ВК-36 film adhesive were analyzed by using Fourier-transform infrared spectroscopy (FTIR) and X-ray photon electron spectroscopy (XPS). Main compositions of ВК-36 film adhesive are similar to those of SY-14A film adhesive except that ВК-36 film adhesive has a great amount of aluminum powder and fumed silica. Dynamic differential scanning calorimetry (DSC) experiments at multiple heating rates (
β
) were performed to obtaine the characteristic reaction temperatures (maximum cure peak temperatures
T
p
) of ВК-36 film adhesive. Based on changes of
T
p
with different heating rates (
β
) from DSC curves
a linear equation
T
p
=
T
1
+Δ
T
ln
β
had been set up to determine the curing temperature more reasonably. The above equation can be used to explain some laws of higher or lower of apparent activation energies (
E
a
)
by which the apparent activation energy (
E
a
) is nearly equal to
RT
1
2
/Δ
T
. The apparent activation energy (
E
a
) values determined by the simple equation (
E
a
≈
RT
1
2
/Δ
T
) are similar to those determined by methods of Kissinger and Ozawa. Activation energy (
E
a
) results calculated with different data assembles show that Ea values have increasing trend with increasing peak temperatures data due to increasing heating rate. The simple equation (
E
a
≈
RT
1
2
/Δ
T
) is derived by using limit-calculating method.
关键词
胶膜热分析固化工艺固化动力学极限法
Keywords
Film adhesiveThermal analysisCuring processCure kineticsLimit-calculating method