Polyimide (PI) has excellent insulation properties

mechanical properties

heat resistance

radiation resistance

etc.

and is widely used in high-precision intelligent control systems

5G communication terminals and base stations. However

the thermal conductivity coefficients (λ) of PI materials are low

which cannot meet the thermal conductivity/heat dissipation requirements of current and future high-power electronic and electrical equipment. Therefore

research and development of the new generation of thermally conductive PI materials has become a research hotspot at home and abroad. This review systematically summarizes the research progress of thermally conductive PI materials

mainly from two aspects: intrinsically thermally conductive PI and thermally conductive PI composites. Related concepts

classifications and influencing factors are introduced

the preparation and research progress of thermally conductive PI materials are expounded

and the thermal conduction mechanisms of thermally conductive PI materials are analyzed. Finally

the current challenges in this field are summarized

and the development directions of thermally conductive PI materials are prospected.