Polyimide dielectrics are essential insulation materials for the fields of electrical engineering

electronic information technology and aerospace. However

there are still issues in material design and preparation

structure-performance relationship and performance regulation that have not been solved in practical applications. The mismatch between dielectric properties and application settings has limited the innovation-oriented development of polyimide

which has become an important problem restricting the progress of electrical and electronic information fields. Based on the basic principles affecting the electrical-thermal properties of dielectric films

this paper provides a detailed review of the research methods and internal mechanisms for regulating the comprehensive performance (such as high/low dielectric properties

thermal stability and insulation resistance) of polyimide from the aspects of molecular structure modification and composite structure optimization. The current issues and challenges of polyimide films in energy systems and electronic devices are summarized

and meaningful guidance is provided for the future development and application of polyimide films.