分子半导体改性聚合物复合电介质研究进展

刘芾源; 佟辉; 曹诗沫; 臧丽坤

doi:10.14028/j.cnki.1003-3726.2024.23.320

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分子半导体改性聚合物复合电介质研究进展

综述 | 更新时间：2024-06-25

- 分子半导体改性聚合物复合电介质研究进展
- Progress on Polymer-matrix Molecular Semiconductor Dielectric Composites
- 高分子通报 2024年37卷第7期页码：868-877
- 作者机构：
  
  1..北京科技大学化学与生物工程学院，北京　 100083
  2..中国科学院电工研究所微纳加工技术与智能电气设备研究部，北京　 100190
  3..中国科学院大学工程科学学院，北京　 100049
- 作者简介：
  
  *佟辉，E-mail: tonghui@mail.iee.ac.cn；臧丽坤，E-mail: zanglikun@ustb.edu.cn
  *佟辉，E-mail: tonghui@mail.iee.ac.cn；臧丽坤，E-mail: zanglikun@ustb.edu.cn
- 基金信息：
  
  北京市自然科学基金(3242026);中国科学院电工研究所科研基金(E155440301)
- DOI：10.14028/j.cnki.1003-3726.2024.23.320
  中图分类号：
- 纸质出版日期：2024-07-20，
  
  收稿日期：2023-09-22，
  
  录用日期：2024-02-05
- 稿件说明：
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刘芾源, 佟辉, 曹诗沫, 臧丽坤. 分子半导体改性聚合物复合电介质研究进展. 高分子通报, 2024, 37(7), 868–877

Liu, F. Y.; Tong, H.; Cao, S. M.; Zang, L. K. Progress on polymer-matrix molecular semiconductor dielectric composites. Polym. Bull. (in Chinese), 2024, 37(7), 868–877
刘芾源, 佟辉, 曹诗沫, 臧丽坤. 分子半导体改性聚合物复合电介质研究进展. 高分子通报, 2024, 37(7), 868–877 DOI： 10.14028/j.cnki.1003-3726.2024.23.320.

Liu, F. Y.; Tong, H.; Cao, S. M.; Zang, L. K. Progress on polymer-matrix molecular semiconductor dielectric composites. Polym. Bull. (in Chinese), 2024, 37(7), 868–877 DOI： 10.14028/j.cnki.1003-3726.2024.23.320.

摘要

Abstract

关键词

有机小分子半导体聚合物分子半导体复合电介质泄漏电流高温储能

Keywords

Organic small molecular semiconductorPolymer molecular semiconductorsComposite dielectricLeakage currentHigh temperature energy storage

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