最新刊期

    卷 36 , 期 8 , 2023
    • YAO Xin-le,WANG Cheng-shuo,YANG Yu-jie,GUO Rui,JI Zhong-ying,GUO Yu-xiong,XIAO Jun-feng,SUN Chu-feng,WANG Xiao-long
      Vol. 36, Issue 8, Pages: 901-913(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.001
      摘要:In recent years, owing to the advantages of high precision, customization, assembly-free and rapid manufacturing, vat photopolymerization 3D printing technology has been widely studied by researchers for solving the problems of polyimide (PI) with miniature precision, special-shaped complex and functional structure integration. A series of vat photopolymerization 3D printing PIs and corresponding forming technologies have been developed based on the principle of vat photopolymerization 3D printing and the physicochemical properties of PI. In this paper, the design and preparation of vat photopolymerization 3D printing PIs are summarized and the research progress of vat photopolymerization 3D printing PI fabricated by stereoscopic lithography (SLA), digital light processing (DLP), and UV-assisted direct writing (UV-DIW) is mainly introduced. The research and development countermeasures are proposed based on the application and industrialization status of vat photo-polymerization (VP) 3D printing PI in the final.  
      关键词:Polyimide;Additive manufacturing;Vat photopolymerization 3D printing;Complex component;Aerospace   
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      发布时间:2023-06-26
    • CONG Bing,WANG Da-ming,ZHAO Xiao-gang,ZHOU Hong-wei,CHEN Chun-hai
      Vol. 36, Issue 8, Pages: 914-928(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.002
      摘要:As a newly developed optical display material, electrochromic/electrofluorochromic dual functional polyamide/polyimide materials have wide prospects. However, the poor solubility of traditional polyamide/polyimide and the high environmental sensitivity of fluorescence limit the development of such materials. In this paper, we analyzed and summarized the diamine monomer containing triphenylamine structure used in electrochromic/electrofluorochromic in recent years and the corresponding polyimide based on the work of our group and other representative work. Moreover, we further analyzed the relationship between the structure and electrochromic/electrofluorochromic performance, especially focusing on the important role of triphenylamine structure in design. According to the different numbers of electroactive nitrogen atoms in the diamine monomer or structural unit, we classified into monovalent system and mixed valence system. The effects of the number of electroactive nitrogen atoms, the position of electroactive nitrogen atoms in the polymer, the number and position of fluorescent groups on the properties of electrochromic/electroluminescent dual functional materials are emphatically discussed. It is expected to provide a new idea for the preparation of high-performance electrochromic/electroluminescent dual functional materials.  
      关键词:Triphenylamine;Electroactive nitrogen atom center;Electrochromic/Electroluminescent;Polyamide/Polyimide   
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      发布时间:2023-06-26
    • QIN Yi-tian,YIN Qian,WANG Xu,LIU Xiang-yang
      Vol. 36, Issue 8, Pages: 929-940(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.003
      摘要:With the rapid development of aerospace, microelectronics and flexible display, polyimide (PI) with better general properties were in urgently needed. Thus, PI containing benzimidazole moieties with asymmetric charge distribution, catalytic capacity, ability of forming hydrogen bonds, and derivative reactivity, exhibited excellent structural designability, mechanical properties, heat resistance, thermal dimensional stability, and functionality, which arose more and more attention on PI containing benzimidazole moieties. In this review, advance in structure and properties of PI containing benzimidazole moieties was reviewed, the effects of benzimidazole moieties on polycondensation of poly(amide acid), imidization, intermolecular interaction, aggregated structure, and the surface/interface structure of PI were especially highlighted. Finally, the future development of polyimide containing benzimidazole was prospected.  
      关键词:Polyimide;Benzimidazole;Structure and properties;Imidization;Aggregated structure;Surface/Interface structure   
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      发布时间:2023-06-26
    • HU Fan,ZHONG Jian-ming,ZHANG Yu,ZHUANG Yong-bing
      Vol. 36, Issue 8, Pages: 941-958(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.004
      摘要:Due to their outstanding heat resistance, chemical stability, membrane formation and mechanical properties as well as highly designable structures, polyimides (PIs) are a promising class of high-performance membrane materials for advanced gas separation applications. However, traditional polyimides are often insoluble and infusible, and show low permeability, physical aging and plasticization behavior, limiting their applications in membrane-based gas separation in industrial scale. Polyimides with intrinsic microporosity (PIM-PIs) exhibited improved gas separation performance as compared with the traditional PIs, while maintaining excellent heat resistance, good film formation and solution-processing ability. As a result, PIM-PIs have great potential in membrane-based gas separation applications. In this review, combined with the author’s research work, synthetic routes of various polyimides for gas separation membranes are reported, the influence of chemical structure (e.g., monomers), aggregated structure (e.g., free volume fraction), and membrane preparation methods on gas separation properties of the resulting PIs are clarified. Further, the modification methods including copolymerization, blending, and crosslinking of PIs in applications for membrane-based gas separation are discussed. Also, an outlook for the future direction of research and development of polyimides for membranebased gas separation and their advanced applications are also presented.  
      关键词:Polyimide;Gas separation;Membrane;Intrinsic microporosity;Modification   
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      发布时间:2023-06-26
    • LI Meng-meng,WU Jing-zhou,ZHANG Qing-hua
      Vol. 36, Issue 8, Pages: 959-967(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.005
      摘要:Polyimide-based aerogels integrate the excellent mechanical properties, good thermal stability against high/low temperature and low thermal conductivity of polyimides and high porosity, low density and low thermal conductivity of aerogel, showing great application prospects in aerospace, military equipment, fire safety and other advanced fields. The chemical structure,preparation technology and the structure-performance relationship are the keys to the development of polyimide aerogels. Combined with the relevant research work of our research group, this paper briefly introduces the research situation of polyimide aerogel, and prospects its future research direction and development trend, providing a useful reference for the subsequent research.  
      关键词:Polyimide;Aerogel;Synthesis;Enhancement;Applications   
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      发布时间:2023-06-26
    • KANG Yong-jun,DONG Nan-xi,WANG Ya-li,LIU Bing-xue,TIAN Guo-feng,QI Sheng-li,WU De-zhen,WEI Jia-ming,LIU Jun
      Vol. 36, Issue 8, Pages: 968-978(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.006
      摘要:Silicon-based anode materials, as the critical components of high energy density lithium ion batteries, play a significant role in using at the commercial market. This review summarizes the research progress and application of binder materials in silicon-based anode for lithium ion batteries, explains the mechanism of binder on improving electrochemical performance, and introduces the traditional silicon-based anode binder systems, such as carboxymethyl cellulose (CMC), poly(acrylic acid) (PAA), alginate (Alg). Polyimide (PI) material, which is widely known for its plentiful structure design, remarkable mechanical strength and reversible deformation, has been the most promising binder material to inhibit the volume expansion and avoid particle fracture of the silicon-based anode. Herein, the research progress of PI binder for silicon-based anode is systematically reviewed, the corresponding design strategies are emphatically proposed, and future novel concepts relating to research as well as application are presented.  
      关键词:lithium ion battery;Binder;Silicon anode;Polyimide   
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      发布时间:2023-06-26
    • LI Mu-kun,GUO Yong-qiang,RUAN Kun-peng,GU Jun-wei
      Vol. 36, Issue 8, Pages: 979-997(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.007
      摘要:Polyimide (PI) has excellent insulation properties, mechanical properties, heat resistance, radiation resistance, etc., and is widely used in high-precision intelligent control systems, 5G communication terminals and base stations. However, the thermal conductivity coefficients (λ) of PI materials are low, which cannot meet the thermal conductivity/heat dissipation requirements of current and future high-power electronic and electrical equipment. Therefore, research and development of the new generation of thermally conductive PI materials has become a research hotspot at home and abroad. This review systematically summarizes the research progress of thermally conductive PI materials, mainly from two aspects: intrinsically thermally conductive PI and thermally conductive PI composites. Related concepts, classifications and influencing factors are introduced, the preparation and research progress of thermally conductive PI materials are expounded, and the thermal conduction mechanisms of thermally conductive PI materials are analyzed. Finally, the current challenges in this field are summarized, and the development directions of thermally conductive PI materials are prospected.  
      关键词:Polyimide;Intrinsic thermal conductivity;Thermally conductive composites;Thermal conductivity coefficient   
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      发布时间:2023-06-26
    • ZHA Jun-wei,LIU Xue-jie,DONG Xiao-di,WAN Bao-quan
      Vol. 36, Issue 8, Pages: 998-1014(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.008
      摘要:Polyimide dielectrics are essential insulation materials for the fields of electrical engineering, electronic information technology and aerospace. However, there are still issues in material design and preparation, structure-performance relationship and performance regulation that have not been solved in practical applications. The mismatch between dielectric properties and application settings has limited the innovation-oriented development of polyimide, which has become an important problem restricting the progress of electrical and electronic information fields. Based on the basic principles affecting the electrical-thermal properties of dielectric films, this paper provides a detailed review of the research methods and internal mechanisms for regulating the comprehensive performance (such as high/low dielectric properties, thermal stability and insulation resistance) of polyimide from the aspects of molecular structure modification and composite structure optimization. The current issues and challenges of polyimide films in energy systems and electronic devices are summarized, and meaningful guidance is provided for the future development and application of polyimide films.  
      关键词:Dielectric materials;Polyimide films;High/Low dielectric permittivity;High temperature resistance   
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      发布时间:2023-06-26
    • WANG Yan-yan,ZHANG Xian,XIAO Chao,DING Xin,ZHENG Kang,LIU Xiang-lan,GONG Yi,CHEN Lin,TIAN Xing-you
      Vol. 36, Issue 8, Pages: 1015-1026(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.009
      摘要:Polyimide (PI) acting as one of the best polymer materials, has been widely used in various microelectronic devices. With the sharp increase in the power density of electronic components, thermal accumulation has become a bottleneck restricting their further development. PI film with high thermal conductivity and electrical insulation is considered as a promising strategy to solve the problem. However, the low thermal conductivity of PI film cannot meet the demand on fast heat dissipation of electronic device. At present, researchers have performed plenty of work in improving the thermal conductivity of PI film. This paper firstly discusses the mechanism of heat transfer in PI film, and then reports the research progress of thermally conductive PI film in recent years, focusing on insulating thermally conductive filler, electrically and thermally conductive filler coated with insulating layer and three-dimensional thermally conductive skeleton reinforcing the thermal conductivity of PI film. Finally, the progress of research on the thermally conductive PI film and the possible future development trends are summarized and prospected.  
      关键词:Polyimide;Thermal conductivity;Thermally conductive filler;Thermal pathway;Composite material   
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      发布时间:2023-06-26
    • MENG Xiang-sheng,KE Hong-jun,YAN Jing-ling,WANG Xian-wei,WANG Zhen
      Vol. 36, Issue 8, Pages: 1027-1041(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.010
      摘要:Thermosetting polyimides have been widely used in aerospace due to their excellent high temperature resistance, mechanical properties, dielectric properties and processability. Herein, the research progress and application in thermosetting polyimides including norbornene-endcapped polyimides, phenylethynyl-endcapped polyimides and other varieties of thermosetting polyimides were reviewed systematically and the research trends in this field were proposed.  
      关键词:Thermosetting polyimides;End-capping reagents;Structure and property;Progress   
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      发布时间:2023-06-26
    • LI Ming-hui,DAI Meng-lu,LIU Feng-ping,HOU Jia-ren,HUANG Gang,GUO Ying-jie,SHI Man-ling,FENG Yuan-hao,YANG Zhuo-yi,ZHAO Le-yao,SUN Jing,FANG Qiang
      Vol. 36, Issue 8, Pages: 1042-1075(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.011
      摘要:Polyimide (PI) is one of the most important engineering plastics. It possesses excellent thermal stabilities and mechanical properties, as well as low dielectric constant and dielectric loss, which make it widely used in the field of microelectronics. With the development of 5G communication technology, polyimide materials with lower dielectric constant are required. In this paper, we review the development of low dielectric polyimide materials in recent years, and discuss the relationship between the structures of polyimide and the dielectric properties, expecting to provide guidance for the preparation of low dielectric polyimide materials in the future.  
      关键词:Polyimide;Low dielectric constant;High frequency communication technology   
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      发布时间:2023-06-26
    • LIU Wei,LIU Gui-hua,HONG Mei,PAN Yan-xiong,JI Xiang-ling
      Vol. 36, Issue 8, Pages: 1076-1089(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.012
      摘要:Polyimide (PI) can be made into films, fibers, foams and has been widely applied in many high-tech fields such as aerospace, liquid crystal display, microelectronics and so on. Among them, the application of PI films is particularly extensive. In the process of preparing PI films from solution, it is very important to control the chain structure of polyimide in the solution which further influences the condensed structure and the properties of the films. Therefore, it is necessary to study the properties of polyimide solutions. The properties of polymer solution include the conformation and flexibility of polymer chain in solution, the molecular parameters related to the chain conformation and their scaling relationships, and the factors affecting the chain conformation. In this paper, recent progress on the solution properties of soluble polyimide was summarized including the chain conformation, basic molecular parameters and their scaling relationships, the effects of structural factors and external conditions (temperature, etc.) on the chain flexibility of some soluble polyimides in different solvents. The future development of the research on the solution properties of soluble polyimide is also proposed.  
      关键词:Soluble polyimides;Solution properties;Chain conformation;Flexibility;Molecular parameters   
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      发布时间:2023-06-26
    • WENG Meng-man,ZHAO Xiao-jun,LUO Xu-liang,MIN Yong-gang
      Vol. 36, Issue 8, Pages: 1090-1100(2023) DOI: 10.14028/j.cnki.1003-3726.2023.08.013
      摘要:Polyimide (PI) is a precursor for the preparation of high-quality graphite-like materials due to its unique molecular structure and high carbon content. At the same time, due to the simple heat treatment process, the preparation form PI to graphite-like materials is expected to move from the laboratory to actual production. Based on the research status of PI-based graphite-like materials at domestic and foreign in recent years, this work summarizes the technical path and research progress of PI-based graphite-like materials prepared from different material forms. Graphite-like films, graphite-like foams and carbon fibers prepared from PI-based materials are highlighted in this work.  
      关键词:Polyimide;Graphite film;Graphite-like foam;Carbon fiber   
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      发布时间:2023-06-26
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